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On the relationship between SiF4 plasma species and sample properties in ultra low-k etching processes - Fig. 12

Correlation coefficient (Pearson) between results of XPS analysis (surface components, surface bonds) and results of QCLAS (etching rate, time constant) and VASE (polymer thickness, damage depth) – see Fig. 12 in the publication.

node194_Fig12.csv
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FieldValue
mimetypetext/csv
filesize389 bytes
resource typefile upload
timestampMay 25, 2020
Resource filetype csv
Resource datatype data table
Resource range Total pressure: 100 mTorr; RF power: 600 W
Resource quality published