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The Fraunhofer Institute for Electronic Nano Systems ENAS is the specialist and development partner in the field of Smart Systems and their integration for various applications. Fraunhofer ENAS has specialized on the challenge of combining micro and nano sensors, actuators and electronic components with interfaces for communication and a self-sufficient energy supply to form smart systems, thus supporting the Internet of Things and the ongoing digitalization.

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On the relationship between SiF4 plasma species and sample properties in ultra low-k etching processes

Materials / Surfaces
Plasma Chemical Processes

The temporal behavior of the molecular etching product SiF4 in fluorocarbon-based plasmas used for the dry etching of ultra low-k (ULK) materials has been brought into connection with the polymer deposition on the surface during plasma treatment within the scope of this work. For this purpose, the density of SiF4 has been measured time-resolved using quantum cascade laser absorption spectroscopy (QCLAS). To correlate the temporal development of the SiF4 density with the ULK damage, Variable Angle Spectroscopic Ellipsometry (VASE) and X-ray photoelectron spectroscopy (XPS) were performed on the treated ULK samples. The dataset corresponds to the findings published under the title “On the relationship between SiF4 plasma species and sample properties in ultra low-k etching processes” with open access in AIP Advances 2020.

ultra low-k etching
infrared laser
absorption spectroscopy
XPS
ellipsometry
FieldValue
Group
FhI ENAS
INP
Authors
Haase, Micha
Melzer, Marcel
Lang, Norbert
Ecke, Ramona
Zimmermann, Sven
van Helden, Jean-Pierre
Schulz, Stefan
Release Date
2020-05-14
Identifier
87c54eb6-1526-4952-95ce-2188736f976a
Permanent Identifier (DOI)
10.34711/inptdat.194
Permanent Identifier (URI)
https://www.inptdat.de/node/194
Is supplementing
M. Haase et al., AIP Advances 10 (2020) 065212
Plasma Source Name
Applied Materials Centura 5200
Plasma Source Application
etching
Plasma Source Specification
AC
high frequency
low pressure
non-thermal
Plasma Source Properties

Magnetic enhanced reactive ion etch (MERIE) chamber of a Centura 5200 cluster system (Applied Materials): radio frequency (RF) excitation at 13.56 MHz, RF power 600 W.
Plasma Source Procedure

Chamber wall temperature as well as substrate temperature is set to 288 K.
Plasma Medium Name
CF4
CHF3
Ar
Plasma Medium Properties

Gas mixtures of CF4, CHF3 and Ar at constant total flow of 100 sccm and constant total pressure of 100 mTorr.
Plasma Target Name
Si wafer
SiOCH
Plasma Target Properties
Cutted pieces of 10 times 10 cm from a 300 mm wafer with 500 nm thick porous SiOCH layer (dielectric constant = 2.4) deposited on Si via PECVD.
Plasma Target Procedure
Each peace is placed on an Al wafer with 200 mm diameter to be handled in the Centura cluster system.
Plasma Diagnostics Name
QCLAS
VASE
XPS
Plasma Diagnostics Properties

Quantum cascade laser absorption spectroscopy (QCLAS): Q-MACS process fiber system from neoplas control, effective absorption length 5.4 m (12 passes), time resolution 1 Hz.

Variable angle spectroscopic ellipsometry (VASE): SE850 system from Sentech, incident angles 50°, 60°, and 70°, wavelength range 400-850 nm.

X-ray photoelectron spectroscopy (XPS): R3000 electron energy analyzer from VG Scienta, pass energy 200 eV, monochromatic Al-Kα radiation from a MX 650 X-ray source from VG Scienta.
Plasma Diagnostics Procedure

In situ and time-resolved determination of SiF4 concentration by QCLAS:
Enhancement of sensitivity due to a mulitpass optics (neoplas control) implemented at the chamber increasing the effective absorption length to 5.4 m by setting 12 passes. Time resolution was set to 1 Hz. The absorption of SiF4 was detected in the range between 1030.90 cm-1 and 1031.00 cm-1.

Ex situ determination of layer thicknesses and refractive Indices by VASE:
Each sample was measured at three incident angles (50°, 60°, and 70°) in the wavelength range between 400 nm and 850 nm. For the analysis, the partially etched SiOCH layer was modelled with three layers consisting of 6 parameters, i.e. refractive index and film thickness for the polymer film, for the damaged SiOCH film, and for the non-damaged SiOCH film, respectively.

Ex situ analysis of elemental composition of plasma treated surfaces by XPS:
To compensate for charging of the isolated samples, an electron flood gun was applied during the XPS measurement such that the Si 2p peak was shifted to 103.5 eV binding energy corresponding to SiO2. For the analysis of the XPS spectra, CasaXPS Version 2.3.16 Pre-rel 1.4 was applied using Scofield relative sensitivity factors in combination with a Shirley background. A numerical approximation for a Voigt profile (Lorentz 30% share) was used as a line shape model to determine the respective peaks of the deconvolution. The full width at half maximum has been limited to 1.5 − 3.0 eV for the deconvolution.
Language
English
License
Creative Commons Attribution 4.0 International (CC BY 4.0)
Public Access Level
Public
Contact Name
Lang, Norbert
Contact Email
lang@inp-greifswald.de

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